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Our PCB Assembly facilities are as follows:

  • 2 fully automated SMT Lines for PCB assembly
  • SMT capabilities – down to 0201 (EIA)
  • Ball Grid Array BGA – 0.50mm pitch
  • Placement – Fuji & Juki
  • Reflow ovens – Heller
  • Wave soldering
  • Screen Printing
  • X-ray Inspection & Rework station
  • 3D X-ray
  • Automatic Optical Inspection
  • COB die bonding
  • In-circuit testing

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